SCHOTT-Semicon Glass Solutions-Picture-Glass powered Chip_06_B

Advanced IC packaging and integration

Integrated circuit (IC) packaging is essential for protecting data and telecom electronics, and also a key factor to drive future chip performance. Specialty glass offers great inherent material properties and design freedom, which is why industry leaders move to glass for semiconductor packaging. SCHOTT offers a broad variety of solutions for high-performance packaging.
Glass Carrier Wafer and Glass Carrier Panel

Glass carrier

Glass carrier wafers streamline processes such as 3D IC packaging, wafer thinning, and fan-out wafer-level packaging (FO-WLP). With wide thermal expansion rates, mechanical and chemical robustness, high transmission, and geometric accuracy, SCHOTT glass wafers and panels are the preferred choice for both front-end and back-end packaging processes. These wafers offer transparency, ensuring precise alignment and handling during production.

Learn more
A range of transparent SCHOTT Glass Panels on dark background

Glass core substrate

IC substrates and interposers utilizing glass instead of polymer or silicon are vital for high-density interconnection of chips and passive components. SCHOTT glass panels, with variable thermal expansion (CTE) properties, offer excellent thermal and chemical resistance, making them ideal for microstructuring and metallization. Their high raw glass quality and broad CTE range support superior processing performance and accuracy.

Learn more