Semiconductor & Datacom

In 1965, Gordon Moore observed that circuit density on a chip doubles every two years. Today, as chip feature sizes near the atomic limit, further miniaturization is reaching its physical limits. But material science is redefining advanced packaging. Next-generation glass core substrates offer a breakthrough in chip performance – delivering up to 40% more speed and unlocking new possibilities for the future of semiconductor devices.

Did you know that a single AI interaction – like a ChatGPT query – can consume as much energy as powering a 10W light bulb for 18 minutes? AI applications rely on specialized chips that process massive amounts of data at incredible speeds and require a lot of energy to do so. Glass-based substrate technology can revolutionize semiconductor efficiency, boosting performance while reducing energy consumption. This can help make AI and high-performance computing more sustainable for the future.

In pursuit of ultimate precision, the semiconductor industry continues to pack more transistors into increasingly smaller chips. Advanced lithography machines now utilize ultra-short wavelengths of light to etch features 10,000 times finer than a human hair. This level of precision is made possible by SCHOTT’s specialty materials. Our glass ceramics, optical glass, and flexible light guides provide essential properties – such as the near-zero thermal expansion of ZERODUR® – to enable the next generation of semiconductor technology.