Front-end process

High-purity quartz is a key material in semiconductor manufacturing, especially used throughout the front-end process. SCHOTT supplies quartz base materials ranging from standard purity to ultra-high purity and near net shape, customized to meet the requirements of advanced processes.

Plasma etch equipment

Plasma etching technology uses high-energy plasma ions to etch materials, enabling precise removal and patterning of thin film materials. Quartz rings isolate, protect, and stabilize the etching chamber during the etching process, preventing etching gas contamination of the chamber and wafer, and ensuring stability and uniformity of the etching process. SCHOTT quartz materials are widely used in plasma etching equipment, serving as key materials for chamber components.

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Epitaxy equipment

Epitaxy refers to a technology used in the chip manufacturing process to grow new crystals on the original wafer to make a new semiconductot layer. Opaque quartz glass is an ideal choice for componebts in epitaxy chambers. Because of ist low thermal transmittance and conductivity, SCHOTT‘s opaque quartz glass is applied in key epitaxy equipments.

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Diffusion equipment

Diffusion refers to the process of using the principle of thermal diffusion to introduce impurity elements into the silicon substrate according to process requirements under high temperature conditions. It has a specific concentration distribution to change the electrical properties of the silicon material. SCHOTT’s electrically fused quartz materials are ideal for diffusion processes due to their very low OH-content and low alkali metals.

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