Glass Panels for advanced semiconductor packaging

Glass enables high-density interconnects and advanced heterogeneous packaging thanks to precisely tailored coefficients of thermal expansion (CTE), high stiffness, excellent electrical properties, superior thermal stability, and ultra-smooth surfaces. Its precise structurability allows for fine-line lithography, optimal via formation, and improved thermal management in thin packages. SCHOTT offers a comprehensive portfolio of customizable glass solutions specifically addressing challenging industry trends such as increased data transfer rates, growing I/O densities, larger panel sizes, and the emergence of next-generation technologies like co-packaged optics. As a cost-effective material, glass is rapidly becoming the preferred choice for cutting-edge IC and microelectronic packaging.