High-performance glass carriers for advanced semiconductor packaging
What are glass carrier wafers?
Why choose SCHOTT glass carriers?
Our glass carriers are essential in semiconductor applications as temporary bonding and debonding substrates for silicon wafers and dies. SCHOTT glass with high optical transmission – from UV to IR – enables efficient laser-assisted debonding and advanced packaging solutions.
As semiconductor architectures become more complex, demand for ultra-flat, mechanically and chemically stable carrier materials continues to grow. Glass wafers and panels are widely used in 2.5D and 3D ICs, fan-out wafer- and panel-level packaging (FOWLP/FOPLP), and wafer thinning applications.
Advantages of glass carrier
Glass carriers are becoming increasingly important in the fast moving world of semiconductors. This is due to the following key properties:
Glass carrier highlights
Geometrical properties of SCHOTT glass carrier
| Item | Wafer(1) | Panel(1) |
|---|---|---|
| Format | 6", 8", 12" [150–300 mm] | max. 650 × 650 mm(2) |
| Thickness(3) | 0.40 – 2.75 mm | 0.50 – 2.75 mm |
| Thickness tolerance(4) | ± 2.5 – 5.0 µm | ± 15 – 20 µm |
| Total thickness variation (TTV)(4) | ≤ 0.5 – 2.0 µm | ≤ 15 – 20 µm |
| Warp(4) | 12": ≤ 50 µm 8": ≤ 30 µm |
≤ 100 – 200 µm |
| Cosmetic quality Scratch/Dig | 40/20 – 20/10 | 40/20 – 20/10 |
(1) Tighter specifications upon request
(2) Typically 600 x 600 mm
(3) Typical values, other thicknesses on demand possible
(4) Typical values, depending on glass type and thickness
Bonding and debonding of glass carrier
Spectral transmittance: thickness 1.1 mm for λ = 250 nm to 400 nm
Spectral transmittance: thickness 1.1 mm for λ = 200 nm 500 nm
SCHOTT glass carrier can be delivered as follows:
- Flat/notch: According to SEMI standard
- Laser marking: According to SEMI standard, T7, QR-Barcode/unique number
- Cleaning: Ultra/mega-sonic cleaning and cleanroom ISO 6
- Packaging: Inspection and packaging under ISO 6 in wafer boxes (FOSB, RTU, etc.)
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