Microelectronic Packaging
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Technical Details of Microelectronic Packaging

SCHOTT draws on more than 80 years of experience in developing and manufacturing hermetically-sealed packages and is the only vendor in Europe that offers a complete portfolio of hermetic packaging technologies. By covering all essential and quality-critical processes in-house, we can offer fully custom-made components that fulfill even the most difficult requirements.

Outstanding properties and a wide range of choices

True reliability

As a dedicated supplier with decades of experience in safety-critical applications, SCHOTT manufactures products that meet the highest performance and longevity expectations – even in working environments with extreme pressure, vibration, and temperatures of 175°C (347°F).

Big in miniaturization

Glass-to-metal sealing can enable the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form-factor hermetic packages with high I/O count.

Superior thermal management

SCHOTT Microelectronic Packaging offers extraordinary thermal conductivity and powerful temperature resistance beyond 300°C, making them well-suited for handling the heat in high-power applications.

High-speed products. Integrated solutions

Catering to high-speed requirements, we offer coaxial high-frequency ports, as well as integrated features, such as connectors or circuits. This increases efficiency for customers, who can remove these steps from their own production processes.
Product variety
Technology
Technical specifications

Product variety

We offer microelectronic housings as custom-designed microwave packages, power packages, multi-pin MCM packages, dewar flanges, amplifier packages, RF packages, and much more.

 

Product variety of Microelectronic packaging

Technologies

Glass-to-Metal Sealing – SCHOTT GTMS

  • Glass-to-metal sealed (GTMS) microelectronic packages offer excellent performance when it comes to effectively protecting electronic systems, defending sensitive components against harsh environmental conditions, and supporting efficient transmission of optical signals.

  • SCHOTT’s GTMS packages are extremely effective at protecting a comprehensive range of components – electronic, opto-electronic and microelectronic – in diverse industrial and technical fields, including microwave packaging, sensor and medical technology, and power electronics.

  • Efficient transmission of optical signals. Protection for electronic, opto-electronic, and microelectronic parts. Diverse uses from sensor technology to power electronics.
    Find out more about glass-to-metal sealing technology.

Laser Welding

  • Laser welding is an innovative process that opens new possibilities for electrical and mechanical connection of components using the same or different material compositions.

  • With this approach, the hermetic seal is formed at room temperature, which protects the electronics from heat damage.

  • Laser welding is a flexible technique with multiple implementation possibilities. It can be performed at the component level all the way up to batch processing scales, making it easy and cost-effective to scale up for high-volume manufacturing.

  • Because laser welding uses corrosion-resistant material, it is especially suitable for medical applications such as medical implants, batteries, and endoscopes.

Brazing and Soldering

  • Brazing and soldering enable electrical, mechanical, and thermal connection of components using the same or different materials with similar CTEs.

  • These connection techniques work well for any application but are especially useful for challenging packages that have a large number of electrical, optical, mechanical, and thermal interfaces.

  • Metal brazing and soldering is ideal for large metal housings because it enables cost-effective manufacturing processes such as deep drawing and metal injection molding.

  • The solder cascade can be outlined at temperatures ranging from 1100°C to soft soldering temperatures of 180°C.

Technical specifications

SCHOTT Microelectronic Packaging

Technical Details

 Gas-tightness

  • Hermeticity: better than 1 x 10-8 mbar x l/s

 Temperature resistance

  • Temperature resistance: > 250 °C

  • Thermal shock stability: -65 °C to 150 °C for 15 cycles

 Chemical resistance

  • Salt spray resistance: Special coatings can assure high corrosion resistance event
    after extremely aggressive 24-hour salt spray tests 

 Formats available

  • Machined types (Customized solution) 

  • Flatpacks (Stamped solutions) 

  • Plug-Ins (Stamped solutions) 

 Electrical interfaces

  • Low / high voltage feedthroughs

  • Coaxial (e.g. SMA, SMP, etc.) high frequency interfaces up to 80 GB/s

  • Lead frames / BGA / PGA / standards connector interfaces 

  • Feedthroughs for high currents 

 Optical interfaces

  • Windows 

  • Lenses 

  • Fiber optic ferrules 

 Thermal interfaces

  • (Partial) Heat sinks for dissipating heat loss from the active device (Cu-W, Mo, Al-Si, Mo-Cu) 

  • Heat spreaders

 Metals

  • Standard metals
    - Kovar 
    - Stainless steel 
    - Cold rolled steel 
    - Copper
    - Molybdenum
    - Copper molybdenum
    - Copper tungsten (CuW)
    - Aluminum Silicon (AlSi)
    - Titanium and titanium alloys

  • Metals for special requirements
    - Titanium for light-weight, non-magnetic and biocompatible requirements
    - Aluminum for light-weight requirements 
    - Monel for chemically aggressive environments 

  • Available metal coatings
    - Electroless / Electrolytic Nickel 
    - Gold (Soft / Hard Au) 
    - Silver copper

 Available fusing processes

  • Glas-to-metal sealing

  • Low temperature brazing

  • High temperature brazing

  • Vacuum brazing 

  • Reflow brazing 

Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

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Georg Mittermeier
Georg Mittermeier

Product Manager