Applications of hermetic sensor packaging
SCHOTT’s hermetic packages for sensors are used across various industries that demand robustness, longevity, high-temperature resistance, and precision in monitoring and control systems. By providing the secure encapsulation of sensitive sensor components, our packaging solutions enable reliable performance in challenging environments. Applications include automotive, aerospace, aviation & defense as well as industrial sectors like food processing and chemical manufacturing.
Pressure sensors
Hermeticity in pressure sensor packaging is vital for protecting sensors from moisture, contaminants, and extreme temperatures, particularly in demanding applications like automotive, aerospace, aviation & defense, and industrial systems. Advanced materials and new sealing techniques can enhance durability and reliability in high-pressure environments.
High-temperature sensors
For temperature sensors, hermetic packaging is vital for maintaining reliability in extreme conditions. SCHOTT’s pioneering HEATAN® glass-ceramic-to-metal sealing technology provides heat stability beyond 1000°C, ideal for high-demand environments like automotive engines, aerospace, and industrial processes. This advanced packaging protects against contamination and offers sensor durability, meeting the rigorous demands of critical applications.
Level / Flow sensors
Our hermetic packaging components are used in a wide range of sensors, including level sensors, flow sensors, gas sensors, and inertial measurement sensors. These components are essential in applications where the concentration, level, and flow of liquids or gases must be precisely monitored. Applications include fuel injection and flex-fuel systems in diesel and petrol engines; measurement of liquid substances in the chemical, petrochemical, energy, and food industries; and CO₂ monitoring systems.
Optical sensors
Precision and high performance are crucial for optical sensors, including laser diodes, photodiodes, LiDAR sensors, and IR and UV industrial flame sensors. SCHOTT packaging components provide reliable hermetic sealing and precise optical interfaces, ensuring optimal performance for these sensors.
MEMS Sensors
Our established expertise in Transistor Outline packaging enables us to offer simple, economical, and extremely shock- and vibration-resistant MEMS packaging options. With highly innovative glass micro bonding technology offered through SCHOTT Primoceler™, we also manufacture ultra-miniature hermetic Wafer-Level Chip Scale Packaging, which is particularly well-suited for next-generation medical, RF, and industrial MEMS sensors.
Image Sensors
SCHOTT offers hermetic Wafer-Level Chip Scale Packaging and integrated sensor packages for image sensing applications. Our range of high-precision optical interfaces includes hermetic windows with sapphire glass, which offer extreme scratch-resistance and mechanical strength, excellent thermal conductivity and heat resistance, as well as high transmittance (UV to IR).
Relays
A relay is an electrical switch that opens and closes under the control of another electrical circuit. In some instances, it is absolutely vital that relays are hermetically sealed – for example, in aerospace, mobility, and military applications with harsh operating environments. SCHOTT’s glass-to-metal sealed housing components protect switches and provide them with power.
Dr.-Ing. Jens Suffner
Head of Product Group Sensors & Batteries